JPH0227574Y2 - - Google Patents
Info
- Publication number
- JPH0227574Y2 JPH0227574Y2 JP3405883U JP3405883U JPH0227574Y2 JP H0227574 Y2 JPH0227574 Y2 JP H0227574Y2 JP 3405883 U JP3405883 U JP 3405883U JP 3405883 U JP3405883 U JP 3405883U JP H0227574 Y2 JPH0227574 Y2 JP H0227574Y2
- Authority
- JP
- Japan
- Prior art keywords
- printed wiring
- wiring board
- substrate
- board
- electrode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 230000005606 hygroscopic expansion Effects 0.000 claims description 3
- 238000000034 method Methods 0.000 claims description 3
- 239000004820 Pressure-sensitive adhesive Substances 0.000 claims 1
- 239000000758 substrate Substances 0.000 description 24
- 239000000919 ceramic Substances 0.000 description 14
- 238000005476 soldering Methods 0.000 description 13
- 239000011347 resin Substances 0.000 description 10
- 229920005989 resin Polymers 0.000 description 10
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 238000007796 conventional method Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical group [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
Landscapes
- Combinations Of Printed Boards (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3405883U JPS59140466U (ja) | 1983-03-11 | 1983-03-11 | 回路基板接続装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3405883U JPS59140466U (ja) | 1983-03-11 | 1983-03-11 | 回路基板接続装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS59140466U JPS59140466U (ja) | 1984-09-19 |
JPH0227574Y2 true JPH0227574Y2 (en]) | 1990-07-25 |
Family
ID=30164827
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP3405883U Granted JPS59140466U (ja) | 1983-03-11 | 1983-03-11 | 回路基板接続装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS59140466U (en]) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005086658A (ja) * | 2003-09-10 | 2005-03-31 | Nippon Dengyo Kosaku Co Ltd | 偏波共用アンテナ |
DE102023206591A1 (de) | 2023-07-11 | 2025-01-16 | Robert Bosch Gesellschaft mit beschränkter Haftung | Verfahren zur Herstellung einer elektrisch leitenden Verbindung |
-
1983
- 1983-03-11 JP JP3405883U patent/JPS59140466U/ja active Granted
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005086658A (ja) * | 2003-09-10 | 2005-03-31 | Nippon Dengyo Kosaku Co Ltd | 偏波共用アンテナ |
DE102023206591A1 (de) | 2023-07-11 | 2025-01-16 | Robert Bosch Gesellschaft mit beschränkter Haftung | Verfahren zur Herstellung einer elektrisch leitenden Verbindung |
Also Published As
Publication number | Publication date |
---|---|
JPS59140466U (ja) | 1984-09-19 |
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